Invention Grant
US08128418B1 Thermal expansion compensator having an elastic conductive element bonded to two facing surfaces
失效
热膨胀补偿器具有结合到两个相对表面的弹性导电元件
- Patent Title: Thermal expansion compensator having an elastic conductive element bonded to two facing surfaces
- Patent Title (中): 热膨胀补偿器具有结合到两个相对表面的弹性导电元件
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Application No.: US12857965Application Date: 2010-08-17
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Publication No.: US08128418B1Publication Date: 2012-03-06
- Inventor: William Determan , Daniel Edward Matejczyk
- Applicant: William Determan , Daniel Edward Matejczyk
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrand Space Systems International, Inc.
- Current Assignee: Hamilton Sundstrand Space Systems International, Inc.
- Current Assignee Address: US CT Windsor Locks
- Agency: Cantor Colburn LLP
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
Public/Granted literature
- US20120045948A1 THERMAL EXPANSION COMPENSATOR HAVING AN ELASTIC CONDUCTIVE ELEMENT BONDED TO TWO FACING SURFACES Public/Granted day:2012-02-23
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