Invention Grant
- Patent Title: Semiconductor devices for high power application
- Patent Title (中): 用于高功率应用的半导体器件
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Application No.: US12265580Application Date: 2008-11-05
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Publication No.: US08125028B2Publication Date: 2012-02-28
- Inventor: Hung-Shern Tsai , Geeng-Lih Lin , Wen-Jya Liang
- Applicant: Hung-Shern Tsai , Geeng-Lih Lin , Wen-Jya Liang
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW97114479A 20080421
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
Semiconductor devices for high voltage application are presented. A high power semiconductor device includes a first type doped semiconductor substrate and a second type doped epitaxial layer deposited thereon. A first type doped body region is disposed in the second type doped epitaxial layer. A heavily doped drain region is formed in the second type doped epitaxial layer and isolated from the first type doped body region with an isolation region and a channel. A second type deep heavily doped region extends from the heavily doped drain region to the semiconductor substrate. A pair of inversed type heavily doped source regions is disposed in the first type doped body region. A gate electrode is disposed overlying the channel with a dielectric layer interposed therebetween. The high power semiconductor device is isolated from the other semiconductor devices with a first type deep heavily doped region.
Public/Granted literature
- US20090261409A1 SEMICONDUCTOR DEVICES FOR HIGH POWER APPLICATION Public/Granted day:2009-10-22
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