发明授权
- 专利标题： Integration manufacturing process for MEMS device
- 专利标题（中）： MEMS器件集成制造工艺
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申请号： US13072879申请日： 2011-03-28
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公开(公告)号： US08114699B2公开(公告)日： 2012-02-14
- 发明人: Migching Wu , Hsueh-An Yang , Hung-Yi Lin , Weileun Fang
- 申请人： Migching Wu , Hsueh-An Yang , Hung-Yi Lin , Weileun Fang
- 申请人地址： TW Taipei
- 专利权人： Walsin Lihwa Corp.
- 当前专利权人： Walsin Lihwa Corp.
- 当前专利权人地址： TW Taipei
- 代理机构： Chen Yoshimura LLP
- 优先权： TW93117781A 20040618
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.
公开/授权文献
- US20110174058A1 INTEGRATION MANUFACTURING PROCESS FOR MEMS DEVICE 公开/授权日：2011-07-21
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