Invention Grant
- Patent Title: Apparatus and methods for filament crimping and manufacturing
- Patent Title (中): 灯丝压接和制造的装置和方法
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Application No.: US12829208Application Date: 2010-07-01
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Publication No.: US08113243B2Publication Date: 2012-02-14
- Inventor: Robert Bogursky , Leonid Foshansky , Craig Kennedy , Darrel Wood , Mark Saunders
- Applicant: Robert Bogursky , Leonid Foshansky , Craig Kennedy , Darrel Wood , Mark Saunders
- Applicant Address: US CA San Diego
- Assignee: Autosplice, Inc.
- Current Assignee: Autosplice, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Gazdzinski & Associates, PC
- Main IPC: B21F1/00
- IPC: B21F1/00

Abstract:
Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.
Public/Granted literature
- US20110000577A1 APPARATUS AND METHODS FOR FILAMENT CRIMPING AND MANUFACTURING Public/Granted day:2011-01-06
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