发明授权
- 专利标题： Thermal interface with non-tacky surface
- 专利标题（中）： 具有非粘性表面的热界面
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申请号： US12858849申请日： 2010-08-18
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公开(公告)号： US08110919B2公开(公告)日： 2012-02-07
- 发明人: Radesh Jewram , Sanjay Misra
- 申请人： Radesh Jewram , Sanjay Misra
- 申请人地址： US MN Chanhassen
- 专利权人： The Bergquist Company
- 当前专利权人： The Bergquist Company
- 当前专利权人地址： US MN Chanhassen
- 代理机构： Haugen Law Firm PLLP
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H05K13/00
摘要：
A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.
公开/授权文献
- US20100309634A1 Thermal Interface with Non-Tacky Surface 公开/授权日：2010-12-09
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