发明授权
- 专利标题： Light-emitting diode module and manufacturing method thereof
- 专利标题（中）： 发光二极管模块及其制造方法
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申请号： US11827475申请日： 2007-07-12
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公开(公告)号： US08110842B2公开(公告)日： 2012-02-07
- 发明人: Ssu-Yuan Weng
- 申请人： Ssu-Yuan Weng
- 申请人地址： TW New Taipei
- 专利权人： Everlight Electronics Co., Ltd.
- 当前专利权人： Everlight Electronics Co., Ltd.
- 当前专利权人地址： TW New Taipei
- 代理机构： Han IP Law PLLC
- 代理商 Andy M. Han
- 优先权： TW96117895A 20070518
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package structures. A Lens laminated plate is subsequently bonded onto the LED package structures. The lens laminated plate includes plural lenses, and each lens is located right above a LED of each LED package structure. Finally, plural LED modules are formed by cutting the substrate along the space. A LED module structure is also disclosed.
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