发明授权
- 专利标题: Wireless IC device and component for wireless IC device
- 专利标题(中): 无线IC器件及无线IC器件组件
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申请号: US12543553申请日: 2009-08-19
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公开(公告)号: US08078106B2公开(公告)日: 2011-12-13
- 发明人: Yuya Dokai , Noboru Kato , Satoshi Ishino
- 申请人: Yuya Dokai , Noboru Kato , Satoshi Ishino
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2006-011626 20060119; JP2006-079099 20060322; JP2006-146258 20060526; JP2006-182685 20060630; JP2006-236777 20060831
- 主分类号: H04B7/00
- IPC分类号: H04B7/00 ; H04B1/16
摘要:
A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
公开/授权文献
- US20090308938A1 WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE 公开/授权日:2009-12-17
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