Invention Grant
- Patent Title: Cooling structure, heatsink and cooling method of heat generator
- Patent Title (中): 发电机冷却结构,散热器和冷却方式
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Application No.: US11520693Application Date: 2006-09-14
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Publication No.: US08061412B2Publication Date: 2011-11-22
- Inventor: Shigetoshi Ippoushi , Akira Yamada , Hirotoshi Maekawa , Fumiharu Yabunaka
- Applicant: Shigetoshi Ippoushi , Akira Yamada , Hirotoshi Maekawa , Fumiharu Yabunaka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20

Abstract:
A cooling structure includes a heat dissipation structure having a heat generator and a heatsink that is adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility; and a fluid flow path that is disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink may directly come into contact. Furthermore, on a surface of the heatsink that directly comes into contact with the cooling fluid, a fine recess is disposed.
Public/Granted literature
- US20070062674A1 Cooling structure, heatsink and cooling method of heat generator Public/Granted day:2007-03-22
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