发明授权
- 专利标题： Integrated circuit devices with stacked package interposers
- 专利标题（中）： 具有堆叠封装内插器的集成电路器件
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申请号： US12625384申请日： 2009-11-24
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公开(公告)号： US08058716B2公开(公告)日： 2011-11-15
- 发明人: Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
- 申请人： Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Wells St. John P.S.
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
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