Invention Grant
US08053834B2 Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substrates
有权
使用导电衬底的反向沟槽接地源FET结构,具有高度掺杂的衬底
- Patent Title: Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substrates
- Patent Title (中): 使用导电衬底的反向沟槽接地源FET结构,具有高度掺杂的衬底
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Application No.: US12653354Application Date: 2009-12-11
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Publication No.: US08053834B2Publication Date: 2011-11-08
- Inventor: François Hébert
- Applicant: François Hébert
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Bo-In Lin
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
This invention discloses an inverted field-effect-transistor (iT-FET) semiconductor device that includes a source disposed on a bottom and a drain disposed on a top of a semiconductor substrate. The semiconductor power device further comprises a trench-sidewall gate placed on sidewalls at a lower portion of a vertical trench surrounded by a body region encompassing a source region with a low resistivity body-source structure connected to a bottom source electrode and a drain link region disposed on top of said body regions thus constituting a drift region. The drift region is operated with a floating potential said iT-FET device achieving a self-termination.
Public/Granted literature
- US20100140693A1 Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substrates Public/Granted day:2010-06-10
Information query
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