发明授权
- 专利标题： Interconnection, electronic device and method for manufacturing an electronic device
- 专利标题（中）： 互连，电子设备和制造电子设备的方法
-
申请号： US12062112申请日： 2008-04-03
-
公开(公告)号： US08053678B2公开(公告)日： 2011-11-08
- 发明人: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Tomio Ono , Mariko Suzuki
- 申请人： Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Tomio Ono , Mariko Suzuki
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Tohshiba
- 当前专利权人： Kabushiki Kaisha Tohshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JPP2007-099542 20070405
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
An interconnection includes a bundle of conductive members, each of the conductive members being made of carbon nanotube having an end connected to a first conductive film, and another end connected to a second conductive film separated from the first conductive film; and carbon particles each having a diamond crystal structure, dispersed between the conductive members.
公开/授权文献
信息查询
