发明授权
- 专利标题： Component adapted for being mounted on a substrate and a method of mounting a surface mounted device
- 专利标题（中）： 适于安装在基板上的部件和安装表面安装装置的方法
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申请号： US12090884申请日： 2006-10-13
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公开(公告)号： US08045334B2公开(公告)日： 2011-10-25
- 发明人: Maurice Alexander Hugo Donners
- 申请人： Maurice Alexander Hugo Donners
- 申请人地址： NL Eindhoven
- 专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人： Koninklijke Philips Electronics N.V.
- 当前专利权人地址： NL Eindhoven
- 优先权： EP05109811 20051021
- 国际申请： PCT/IB2006/053768 WO 20061013
- 国际公布： WO2007/046045 WO 20070426
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K7/10 ; H05K1/03
摘要：
A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.
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