Invention Grant
- Patent Title: Printed circuit board with high density differential pairs
- Patent Title (中): 具有高密度差分对的印刷电路板
-
Application No.: US12126748Application Date: 2008-05-23
-
Publication No.: US08013255B2Publication Date: 2011-09-06
- Inventor: Shou-Kuo Hsu , Chun-Jen Chen
- Applicant: Shou-Kuo Hsu , Chun-Jen Chen
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810300775 20080328
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
An exemplary PCB includes a first reference layer, a first signal layer, and a second signal layer in that order. A first differential pair is arranged in the first signal layer in an edge-coupled structure referencing the first reference layer. A second differential pair is arranged in the second signal layer in edge-coupled structure. A first ground part and a second ground part are symmetrically arranged in the second signal layer and at opposite sides of the second differential pair. The first differential pair is arranged above the first ground part such that a projection of the first differential pair onto the second signal layer having an area coincident with the first ground part. The second differential pair references the first and second ground parts.
Public/Granted literature
- US20090242244A1 PRINTED CIRCUIT BOARD Public/Granted day:2009-10-01
Information query