发明授权
- 专利标题: Composition of liquid, solid and semisolid epoxy resins
- 专利标题(中): 液体,固体和半固体环氧树脂的组成
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申请号: US12240815申请日: 2008-09-29
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公开(公告)号: US07989561B2公开(公告)日: 2011-08-02
- 发明人: Makoto Hayashi , Koshin Nakai , Katsuto Murata
- 申请人: Makoto Hayashi , Koshin Nakai , Katsuto Murata
- 申请人地址: JP Tokyo
- 专利权人: Taiyo Holdings Co., Ltd.
- 当前专利权人: Taiyo Holdings Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Ditthavong Mori & Steiner, P.C.
- 优先权: JP2008-162215 20080620
- 主分类号: C08L63/00
- IPC分类号: C08L63/00 ; C08L63/02 ; C08L63/04 ; H05K1/03
摘要:
A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
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