发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US12354575申请日: 2009-01-15
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公开(公告)号: US07977723B2公开(公告)日: 2011-07-12
- 发明人: Hiroyuki Ogawa , Jun Lin , Hideyuki Kojima
- 申请人: Hiroyuki Ogawa , Jun Lin , Hideyuki Kojima
- 申请人地址: JP Yokohama
- 专利权人: Fujitsu Semiconductor Limited
- 当前专利权人: Fujitsu Semiconductor Limited
- 当前专利权人地址: JP Yokohama
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2008-008825 20080118
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/76 ; H01L29/94 ; H01L31/119
摘要:
A semiconductor device includes a semiconductor substrate, an active region formed in the semiconductor substrate and extending in a first direction, the active region including a transistor sub-region and a capacitor sub-region, a first trench extending around the transistor sub-region, an isolation layer disposed in the first trench, a second trench extending around the capacitor sub-region, a first transistor including a first insulating layer disposed on the transistor sub-region, the first transistor including a first conductive layer disposed on the first insulating layer, and a first capacitor including a second insulating layer extending over the capacitor sub-region and a sidewall of the second trench, the first capacitor including a second conductive layer disposed on the second insulating layer, the active region having an end portion in the first direction opposite to the transistor sub-region and extending across the first capacitor.
公开/授权文献
- US20090184351A1 SEMICONDUCTOR DEVICE 公开/授权日:2009-07-23
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