Invention Grant
- Patent Title: Inline integrated circuit system
- Patent Title (中): 在线集成电路系统
-
Application No.: US12101915Application Date: 2008-04-11
-
Publication No.: US07968981B2Publication Date: 2011-06-28
- Inventor: Jae Hak Yee , Junwoo Myung , Byoung Wook Jang , YoungChul Kim
- Applicant: Jae Hak Yee , Junwoo Myung , Byoung Wook Jang , YoungChul Kim
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.
Public/Granted literature
- US20090258494A1 INLINE INTEGRATED CIRCUIT SYSTEM Public/Granted day:2009-10-15
Information query
IPC分类:
