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US07927922B2 Dice rearrangement package structure using layout process to form a compliant configuration 有权
骰子重排包装结构使用布局流程形成兼容配置

Dice rearrangement package structure using layout process to form a compliant configuration
摘要：
A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of metal traces is electrically connected to the each pads; a protection layer is provided to cover the active surface and the other ends of the exposed metal traces is electrically connected to the plurality of conductive elements, the characteristic in that the package body is a B-stage material.
摘要（中）：

提供了具有活性表面和底表面的骰子，并且多个衬垫设置在活性表面上的骰子重排包装结构， 提供包装体以覆盖所述骰子并且所述多个垫被暴露; 多个金属迹线的一端电连接到每个焊盘; 提供保护层以覆盖有源表面，并且暴露的金属迹线的另一端电连接到多个导电元件，其特征在于封装体是B级材料。

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