发明授权
- 专利标题: Method of modifying vias connection of printed circuit boards
- 专利标题(中): 修改印刷电路板通孔连接的方法
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申请号: US12140325申请日: 2008-06-17
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公开(公告)号: US07925999B2公开(公告)日: 2011-04-12
- 发明人: Ying-Tso Lai , Chien-Hung Liu , Shou-Kuo Hsu
- 申请人: Ying-Tso Lai , Chien-Hung Liu , Shou-Kuo Hsu
- 申请人地址: TW Tu-Cheng, Taipei Hsien
- 专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: TW Tu-Cheng, Taipei Hsien
- 代理商 D. Austin Bonderer
- 优先权: CN200810301061 20080411
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
A design method of printed circuit boards includes the following steps. First, simulate a printed circuit board including power layers, and vias connected to all the power layers. Then, change connections of the vias that tend to draw too much current to be connected to fewer power layers, than the vias that tend to draw less current. Repeat adjusting connections of the vias until all vias draw a similar amount of current such that no via draws more current than an upper limit the vias are designed for. Finally, according to the results, design/fabricate a PCB with vias respectively insulated, as needed, from the power layers that do not need to be connected to the vias.
公开/授权文献
- US20090259984A1 METHOD OF PRINTED CIRCUIT BOARDS 公开/授权日:2009-10-15
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