发明授权
US07923756B2 Metal oxide semiconductor (MOS) device comprising a buried region under drain 有权
金属氧化物半导体(MOS)器件,其包括漏极下的埋置区域

  • 专利标题: Metal oxide semiconductor (MOS) device comprising a buried region under drain
  • 专利标题(中): 金属氧化物半导体(MOS)器件,其包括漏极下的埋置区域
  • 申请号: US12131044
    申请日: 2008-05-31
  • 公开(公告)号: US07923756B2
    公开(公告)日: 2011-04-12
  • 发明人: Hironobu Fukui
  • 申请人: Hironobu Fukui
  • 申请人地址: JP Tokyo
  • 专利权人: Kabushiki Kaisha Toshiba
  • 当前专利权人: Kabushiki Kaisha Toshiba
  • 当前专利权人地址: JP Tokyo
  • 代理机构: DLA Piper LLP (US)
  • 优先权: JP2003-399895 20031128
  • 主分类号: H01L27/088
  • IPC分类号: H01L27/088
Metal oxide semiconductor (MOS) device comprising a buried region under drain
摘要:
A semiconductor device with a metal oxide semiconductor (MOS) type transistor structure, which is used for, e.g. a static random access memory (SRAM) type memory cell, includes a part that is vulnerable to soft errors. In the semiconductor device with the MOS type transistor structure, an additional load capacitance is formed at the part that is vulnerable to soft errors.
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