发明授权
- 专利标题： Controlling warping in integrated circuit devices
- 专利标题（中）： 集成电路器件控制翘曲
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申请号： US12546083申请日： 2009-08-24
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公开(公告)号： US07923347B2公开(公告)日： 2011-04-12
- 发明人: John W. Osenbach , Thomas H. Shilling , Weidong Xie
- 申请人： John W. Osenbach , Thomas H. Shilling , Weidong Xie
- 申请人地址： US PA Allentown
- 专利权人： Agere Systems, Inc.
- 当前专利权人： Agere Systems, Inc.
- 当前专利权人地址： US PA Allentown
- 代理机构： Ryan, Mason & Lewis, LLP
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
公开/授权文献
- US20090311853A1 CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES 公开/授权日：2009-12-17
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