Invention Grant
US07910464B2 Method for manufacturing a semiconductor device having a III-V nitride semiconductor
有权
具有III-V族氮化物半导体的半导体器件的制造方法
- Patent Title: Method for manufacturing a semiconductor device having a III-V nitride semiconductor
- Patent Title (中): 具有III-V族氮化物半导体的半导体器件的制造方法
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Application No.: US12695759Application Date: 2010-01-28
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Publication No.: US07910464B2Publication Date: 2011-03-22
- Inventor: Tomohiro Murata , Yutaka Hirose , Tsuyoshi Tanaka , Yasuhiro Uemoto
- Applicant: Tomohiro Murata , Yutaka Hirose , Tsuyoshi Tanaka , Yasuhiro Uemoto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-432886 20031226
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
A semiconductor device of the present invention includes: a III-V nitride semiconductor layer including a channel region in which carriers travel; a concave portion provided in an upper portion of the channel region in the III-V nitride semiconductor layer; and a Schottky electrode consisting of a conductive material forming a Schottky junction with the semiconductor layer, and formed on a semiconductor layer, which spreads over the concave portion and peripheral portions of the concave portion, on the III-V nitride semiconductor layer. A dimension of the concave portion in a depth direction is set so that a portion of the Schottky electrode provided in the concave portion can adjust a quantity of the carriers traveling in the channel region.
Public/Granted literature
- US20100129992A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2010-05-27
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