发明授权
- 专利标题： Assembling two substrates by molecular adhesion
- 专利标题（中）： 通过分子粘附装配两个底物
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申请号： US11630283申请日： 2005-06-29
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公开(公告)号： US07906362B2公开(公告)日： 2011-03-15
- 发明人: Guy Feuillet , Hubert Moriceau , Stephane Pocas , Eric Jalaguier , Norbert Moussy
- 申请人： Guy Feuillet , Hubert Moriceau , Stephane Pocas , Eric Jalaguier , Norbert Moussy
- 申请人地址： FR Paris
- 专利权人： Commissariat a l'Energie Atomique
- 当前专利权人： Commissariat a l'Energie Atomique
- 当前专利权人地址： FR Paris
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： FR0451374 20040630
- 国际申请： PCT/FR2005/050522 WO 20050629
- 国际公布： WO2006/008411 WO 20060126
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/30 ; H01L21/46 ; H01L21/31 ; H01L21/469
摘要：
An assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, the faces being located facing each other, at least one of the substrates having a surface topography. The method forms an intermediate layer including at least one burial layer on the face of the substrate or substrates having a surface topography to make it (them) compatible with molecular bonding of the faces of substrates to each other from a topographic point of view, resistivity and/or thickness of the intermediate layer being chosen to enable the local electrical bonds, brings the two faces into contact, the substrates positioned to create electrical bonds between areas on the first substrate and corresponding areas on the second substrate, and bonds the faces by molecular bonding.
公开/授权文献
- US20080296712A1 Assembling Two Substrates by Molecular Adhesion 公开/授权日：2008-12-04
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