Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and method for manufacturing the same
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US12248449Application Date: 2008-10-09
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Publication No.: US07842998B2Publication Date: 2010-11-30
- Inventor: Takahisa Kanemura , Takashi Izumida , Nobutoshi Aoki
- Applicant: Takahisa Kanemura , Takashi Izumida , Nobutoshi Aoki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPP2007-264667 20071010
- Main IPC: H01L29/792
- IPC: H01L29/792

Abstract:
According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory device including: a semiconductor substrate; memory cell transistors that are series-connected; and a select transistor that includes: a first diffusion region that is formed in the semiconductor substrate at one end of the memory cell transistors; a first insulating film that is formed on the semiconductor substrate at a side of the first diffusion region; a select gate electrode that is formed on the first insulating film; a semiconductor pillar that is formed to extend upward from the semiconductor substrate and to be separated from the select gate electrode; a second insulating film that is formed between the select gate electrode and the semiconductor pillar; and a second diffusion region that is formed on the semiconductor pillar.
Public/Granted literature
- US20090101959A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-04-23
Information query
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