Invention Grant
- Patent Title: Sensing membrane with stress releasing structure and micro-electro-mechanical system device using the same
- Patent Title (中): 具有应力释放结构的感应膜和使用其的微机电系统装置
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Application No.: US12131961Application Date: 2008-06-03
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Publication No.: US07839052B2Publication Date: 2010-11-23
- Inventor: Chia-Yu Wu , Jien-Ming Chen
- Applicant: Chia-Yu Wu , Jien-Ming Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW96148032A 20071214
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H04R19/00
Abstract:
A sensing membrane applied to a micro-electro-mechanical system (MEMS) device includes a body, a stress releasing structure and a connecting portion. The stress releasing structure for releasing a membrane residual stress surrounds the body. The stress releasing structure has several first perforations and several second perforations. The first perforations are located between the body and the second perforations. The connecting portion connects the stress releasing structure and a substrate of the MEMS device.
Public/Granted literature
- US20090151455A1 SENSING MEMBRANE AND MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE USING THE SAME Public/Granted day:2009-06-18
Information query
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