Invention Grant
- Patent Title: Method and structure for waterproofing a terminal splice
- Patent Title (中): 防水端子接头的方法和结构
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Application No.: US11213731Application Date: 2005-08-30
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Publication No.: US07834268B2Publication Date: 2010-11-16
- Inventor: Hiroyuki Ootsuki
- Applicant: Hiroyuki Ootsuki
- Applicant Address: JP Yokkaichi
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2004-263025 20040909
- Main IPC: H02G15/02
- IPC: H02G15/02

Abstract:
A method of waterproofing a terminal that includes a stopper inserted in one opening of a heat shrinkable tube. The heat shrinkable tube is heat-shrunk in this state to form a cap having a end closure. A fluid thermosetting waterproofing agent is injected into the cap from a second opening. A thermal splice, which is formed from welded strands stripped from a plurality of wire terminals, is inserted and immersed in the thermosetting waterproofing agent. Then, the entire cap is heated and heat-shrunk at a predetermined temperature and the thermosetting waterproofing agent is heat-hardened.
Public/Granted literature
- US20060048965A1 Method and structure for waterproofing a terminal splice Public/Granted day:2006-03-09
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