Invention Grant
- Patent Title: Multi-layer encapsulation of diamond grit for use in earth-boring bits
- Patent Title (中): 金刚石砂粒的多层封装用于钻孔钻头
-
Application No.: US11678304Application Date: 2007-02-23
-
Publication No.: US07810588B2Publication Date: 2010-10-12
- Inventor: Eric E. McClain , Dan E. Scott , Wesley Dean Fuller , Robert M. Welch , Jimmy W. Eason , Marcus R. Skeem , Van J. Brackin
- Applicant: Eric E. McClain , Dan E. Scott , Wesley Dean Fuller , Robert M. Welch , Jimmy W. Eason , Marcus R. Skeem , Van J. Brackin
- Applicant Address: US TX Houston
- Assignee: Baker Hughes Incorporated
- Current Assignee: Baker Hughes Incorporated
- Current Assignee Address: US TX Houston
- Agency: Bracewell & Giuliani LLP
- Main IPC: B21K5/04
- IPC: B21K5/04

Abstract:
A method of constructing an earth-boring, diamond-impregnated drill bit has a first step of coating diamond grit with tungsten to create tungsten-coated diamond particles. These coated particles are then encapsulated in a layer of carbide powder held by an organic green binder material. The encapsulated granules are then mixed along with a matrix material and placed in a mold. The matrix material includes a matrix binder and abrasive particles. The mixture is heated in the mold at atmospheric pressure to cause the matrix binder to melt and infiltrate the encapsulated granules and abrasive particles.
Public/Granted literature
- US20080202821A1 Multi-Layer Encapsulation of Diamond Grit for Use in Earth-Boring Bits Public/Granted day:2008-08-28
Information query