发明授权
- 专利标题： Semiconductor device with surface mounting terminals
- 专利标题（中）： 具有表面安装端子的半导体器件
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申请号： US12155375申请日： 2008-06-03
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公开(公告)号： US07763967B2公开(公告)日： 2010-07-27
- 发明人: Toshiyuki Hata , Takeshi Otani , Ichio Shimizu
- 申请人： Toshiyuki Hata , Takeshi Otani , Ichio Shimizu
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Mattingly & Malur, P.C.
- 优先权： JP2004-065413 20040309
- 主分类号： H01L21/461
- IPC分类号： H01L21/461
摘要：
A semiconductor device has a sealing body formed of an insulating resin and a semiconductor chip positioned within the sealing body. A gate electrode and a source electrode are on a first main surface of the semiconductor chip and a back electrode (drain electrode) is on a second main surface thereof. An upper surface of a portion of a drain electrode plate that projects in a gull wing shape is exposed from the sealing body and a lower surface thereof is connected to the back electrode through an adhesive. A gate electrode plate projects in a gull wing shape on an opposite end side of the sealing body and is connected to the gate electrode within the sealing body. A source electrode plate projects in a gull wing shape on the opposite end side of the sealing body and is connected to the source electrode within the sealing body.
公开/授权文献
- US20080315378A1 SEMICONDUCTOR DEVICE WITH SURFACE MOUNTING TERMINALS 公开/授权日：2008-12-25
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