发明授权
- 专利标题： Method of controlling chemical solution applying apparatus, chemical solution applying apparatus, and method of manufacturing semiconductor device
- 专利标题（中）： 控制化学溶液施加装置，化学溶液施加装置和半导体装置制造方法的方法
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申请号： US11543081申请日： 2006-10-05
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公开(公告)号： US07763309B2公开(公告)日： 2010-07-27
- 发明人: Hirokazu Kato
- 申请人： Hirokazu Kato
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2005-293962 20051006
- 主分类号： B05D3/00
- IPC分类号： B05D3/00
摘要：
A method for controlling a chemical solution applying apparatus is disclosed. The method includes setting at least two dummy dispense rates for dummy dispensation which is periodically carried out by the chemical solution applying apparatus, and switching the dummy dispense rates so that the amount of chemical solution dispensed during a first predetermined period is kept over a predetermined value.
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