Invention Grant
- Patent Title: Method and device for position detection using connection pads
- Patent Title (中): 使用连接垫进行位置检测的方法和装置
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Application No.: US11963073Application Date: 2007-12-21
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Publication No.: US07759955B2Publication Date: 2010-07-20
- Inventor: Franz Reinwald , Gerhard Zojer
- Applicant: Franz Reinwald , Gerhard Zojer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/26
Abstract:
A semiconductor and method is disclosed. One embodiment includes a detector arrangement to detect the position of a connection element. A probe tip, the detector arrangement including first connection pads are arranged on a substrate surface. A first circuit is connected to the first connection pads.
Public/Granted literature
- US20090160470A1 SEMICONDUCTOR AND METHOD Public/Granted day:2009-06-25
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