发明授权
- 专利标题： Method and apparatus for wafer marking
- 专利标题（中）： 晶圆标记方法及装置
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申请号： US12143197申请日： 2008-06-20
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公开(公告)号： US07737567B2公开(公告)日： 2010-06-15
- 发明人: Anthony C. Bonora , Raymond S. Martin , Michael Krolak
- 申请人： Anthony C. Bonora , Raymond S. Martin , Michael Krolak
- 申请人地址： US CA Fremont
- 专利权人： Crossing Automation, Inc.
- 当前专利权人： Crossing Automation, Inc.
- 当前专利权人地址： US CA Fremont
- 代理机构： Martine Penilla & Gencarella, LLP
- 主分类号： H01L23/544
- IPC分类号： H01L23/544 ; B65H1/00
摘要：
A semiconductor substrate is provided. The substrate includes a first surface and an opposing second surface, wherein the first surface includes a marking in a centroid region of the first surface. The marking indicates a location of a center point on the first surface of the semiconductor substrate or identification data unique to the substrate. A system, methods of transporting and marking, and a device for reading the substrate markings are also provided.
公开/授权文献
- US20090001616A1 METHOD AND APPARATUS FOR WAFER MARKING 公开/授权日：2009-01-01
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