发明授权
- 专利标题： Apparatus for housing a micromechanical structure
- 专利标题（中）： 用于容纳微机械结构的装置
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申请号： US11864448申请日： 2007-09-28
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公开(公告)号： US07692317B2公开(公告)日： 2010-04-06
- 发明人: Martin Franosch , Andreas Meckes , Winfried Nessler , Klaus-Gunter Oppermann
- 申请人： Martin Franosch , Andreas Meckes , Winfried Nessler , Klaus-Gunter Oppermann
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dickstein, Shapiro, LLP.
- 优先权： DE10353767 20031117
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
公开/授权文献
- US20080017974A1 APPARATUS FOR HOUSING A MICROMECHANICAL STRUCTURE 公开/授权日：2008-01-24
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