发明授权
- 专利标题： Semiconductor device and wiring board
- 专利标题（中）： 半导体器件和接线板
-
申请号： US11569402申请日： 2005-05-18
-
公开(公告)号： US07692287B2公开(公告)日： 2010-04-06
- 发明人: Masamoto Tago
- 申请人： Masamoto Tago
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2004-152629 20040521
- 国际申请： PCT/JP2005/009062 WO 20050518
- 国际公布： WO2005/114729 WO 20051201
- 主分类号： H01L23/053
- IPC分类号： H01L23/053 ; H01L23/48
摘要：
A wiring board (20A) includes a first wiring portion (10A) having a plurality of wiring layers (1) and external connecting bumps (5), and at least one second wiring portion (15A) having a plurality of contact plugs (14). The second wiring portion is integrated with the first wiring portion such that each terminal (14a) of the second wiring portion is in direct contact with one of the wiring layers of the first wiring portion. Hence, there is no risk to produce an internal stress caused by the diffused component of the solder bump in the junction portion between the second and first wiring portions. Accordingly, even when a semiconductor chip (30) of a low-k material is highly integrated on the wiring board, a highly reliable semiconductor device (50) can be obtained.
公开/授权文献
- US20080237890A1 Semiconductor Device and Wiring Board 公开/授权日：2008-10-02
信息查询
IPC分类:
