发明授权
- 专利标题： Microphone module and method for fabricating the same
- 专利标题（中）： 麦克风模块及其制造方法
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申请号： US11457847申请日： 2006-07-17
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公开(公告)号： US07657025B2公开(公告)日： 2010-02-02
- 发明人: Wei-Chan Hsu , Li-Te Wu , Bing-Ming Ho
- 申请人： Wei-Chan Hsu , Li-Te Wu , Bing-Ming Ho
- 申请人地址： US CA Cupertino
- 专利权人： Fortemedia, Inc.
- 当前专利权人： Fortemedia, Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Thomas, Kayden, Horstemeyer & Risley
- 主分类号： H04M1/00
- IPC分类号： H04M1/00 ; H04M9/00 ; H04R25/00
摘要：
A microphone module. The module comprises a carrier having a first side and an opposing second side and comprising a through hole. A microphone is disposed on the first side of the carrier and corresponding to the through hole. A processing chip is disposed on the first side of the carrier and coupled to the microphone. An encapsulant is disposed on the first side of the carrier to encapsulate the microphone and the processing chip.
公开/授权文献
- US20080037768A1 MICROPHONE MODULE AND METHOD FOR FABRICATING THE SAME 公开/授权日：2008-02-14
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