发明授权
- 专利标题: Pixel structure and manufacturing method thereof
- 专利标题(中): 像素结构及其制造方法
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申请号: US11767484申请日: 2007-06-23
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公开(公告)号: US07656479B2公开(公告)日: 2010-02-02
- 发明人: Hsiang-Lin Lin , Ching-Huan Lin , Te-Chun Huang
- 申请人: Hsiang-Lin Lin , Ching-Huan Lin , Te-Chun Huang
- 申请人地址: TW Hsinchu
- 专利权人: Au Optronics Corporation
- 当前专利权人: Au Optronics Corporation
- 当前专利权人地址: TW Hsinchu
- 代理机构: Jianq Chyun IP Office
- 优先权: TW96109699A 20070321
- 主分类号: G02F1/1333
- IPC分类号: G02F1/1333
摘要:
A pixel structure disposed on a substrate includes a gate, a patterned dielectric layer, a patterned semiconductor layer, a patterned metal layer, an overcoat layer and a transparent pixel electrode. The patterned dielectric layer and the gate covered thereby are disposed on the substrate. The patterned semiconductor layer on the patterned dielectric layer includes bumps and a channel above the gate. The patterned metal layer includes a source, a drain and a reflective pixel electrode connecting the drain. The source and the drain cover a portion of the channel. The reflective pixel electrode covers the bumps. The gate, the patterned dielectric layer, the patterned semiconductor layer and the patterned metal layer form a transistor on which the overcoat layer has a contact hole exposing a portion of the reflective pixel electrode. The transparent pixel electrode on the overcoat layer electrically connects the reflective pixel electrode through the contact hole.
公开/授权文献
- US20080231782A1 PIXEL STRUCTURE AND MANUFACTURING METHOD THEREOF 公开/授权日:2008-09-25
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