发明授权
- 专利标题： Semiconductor package having embedded passive elements and method for manufacturing the same
- 专利标题（中）： 具有嵌入式无源元件的半导体封装及其制造方法
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申请号： US11647702申请日： 2006-12-29
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公开(公告)号： US07652347B2公开(公告)日： 2010-01-26
- 发明人: Seung Taek Yang
- 申请人： Seung Taek Yang
- 申请人地址： KR Kyoungki-do
- 专利权人： Hynix Semiconductor Inc.
- 当前专利权人： Hynix Semiconductor Inc.
- 当前专利权人地址： KR Kyoungki-do
- 代理机构： Ladas & Parry LLP
- 优先权： KR10-2006-0059827 20060629
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/8222
摘要：
A semiconductor package includes a base substrate on which a semiconductor chip is placed so that a first surface thereof faces the base substrate. A circuit section is formed adjacent to the first surface. An insulation layer is formed on a second surface of the semiconductor chip which faces away from the first surface. Passive elements are formed on the insulation layer. Via patterns are formed to pass through the insulation layer and are connected to the passive elements. Via wirings are formed to pass through the semiconductor chip and connected to the circuit section, the via patterns and the base substrate. Outside connection terminals are attached to a first surface of the base substrate, which face away from a second surface of the base substrate on which the semiconductor chip is placed.
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