Invention Grant
US07635418B2 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
有权
等离子体处理装置和从衬底上的选定区域去除外来材料的方法
- Patent Title: Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
- Patent Title (中): 等离子体处理装置和从衬底上的选定区域去除外来材料的方法
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Application No.: US11003062Application Date: 2004-12-03
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Publication No.: US07635418B2Publication Date: 2009-12-22
- Inventor: Robert S. Condrashoff , James D. Getty , James S. Tyler
- Applicant: Robert S. Condrashoff , James D. Getty , James S. Tyler
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Wood, Herron & Evans LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C23C16/00 ; C23C16/04

Abstract:
Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.
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