Invention Grant
US07579759B2 Surface acoustic wave (SAW) devices based on cubic boron nitride/diamond composite structures
有权
基于立方氮化硼/金刚石复合结构的表面声波(SAW)器件
- Patent Title: Surface acoustic wave (SAW) devices based on cubic boron nitride/diamond composite structures
- Patent Title (中): 基于立方氮化硼/金刚石复合结构的表面声波(SAW)器件
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Application No.: US11760996Application Date: 2007-06-11
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Publication No.: US07579759B2Publication Date: 2009-08-25
- Inventor: Shuit-Tong Lee , Wen-Jun Zhang , You-Sheng Zou , Igor Bello , Kwok Leung Ma , Kar Man Leung , Yat Ming Chong
- Applicant: Shuit-Tong Lee , Wen-Jun Zhang , You-Sheng Zou , Igor Bello , Kwok Leung Ma , Kar Man Leung , Yat Ming Chong
- Applicant Address: CN Hong Kong
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: CN Hong Kong
- Agency: Heslins Rothenberg Farley & Mesiti P.C.
- Main IPC: H01L41/09
- IPC: H01L41/09

Abstract:
A surface acoustic wave (SAW) device which is made of cBN/diamond composite structures and the fabrication method are disclosed. In the SAW device based on cubic boron nitride and diamond composite structures, the diamond hard layer includes randomly-oriented polycrystalline diamond (poly-D), oriented (heteroepitaxial) diamond, single-crystal diamond wafers and nanocrystalline diamond (nano-D) films. The cBN film with a sound velocity close to that of diamond serves as the piezoelectric layer, which was directly deposited on diamond hard layer without any soft sp2-BN incubation layer by ion assisted physical vapor deposition (PVD) and plasma-enhanced (or ion assisted) chemical vapor deposition (PECVD). Due to the high sound velocity and the low velocity dispersion between the cBN and diamond layered materials, the present SAW device based on cubic boron nitride and diamond composite structures can improve the device performance and operate at ultra-high frequency range.
Public/Granted literature
- US20080303378A1 SURFACE ACOUSTIC WAVE (SAW) DEVICES BASED ON CUBIC BORON NITRIDE/DIAMOND COMPOSITE STRUCTURES Public/Granted day:2008-12-11
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