发明授权
- 专利标题: EEPROM and method of manufacturing the same
- 专利标题(中): EEPROM及其制造方法
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申请号: US12180521申请日: 2008-07-26
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公开(公告)号: US07572700B2公开(公告)日: 2009-08-11
- 发明人: Chih-Wei Chao , Chin-Wei Hu , Chi-Wen Chen
- 申请人: Chih-Wei Chao , Chin-Wei Hu , Chi-Wen Chen
- 申请人地址: TW Hsinchu
- 专利权人: Au Optronics Corp.
- 当前专利权人: Au Optronics Corp.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Thomas, Kayden, Horstemeyer & Risley
- 优先权: TW94112910A 20050422
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
An EEPROM includes a substrate, a first semiconductor layer and a second semiconductor layer formed on the substrate. The first semiconductor layer is isolated from the second semiconductor layer by a trench. A first source and a first drain are located at two opposing sides of the first semiconductor layer. A first dielectric layer is formed on the first semiconductor layer, and a first floating gate is formed on the first dielectric layer. A second source and a second drain are located at two opposing sides of the second semiconductor layer. A second dielectric layer is formed on the second semiconductor layer, and a second floating gate is formed on the second dielectric layer. The first floating gate and the second floating gate are electrically connected.
公开/授权文献
- US20090117698A1 EEPROM and Method of Manufacturing the Same 公开/授权日:2009-05-07
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