发明授权
US07488661B2 Device and method for improving interface adhesion in thin film structures
有权
用于改善薄膜结构中界面附着力的装置和方法
- 专利标题： Device and method for improving interface adhesion in thin film structures
- 专利标题（中）： 用于改善薄膜结构中界面附着力的装置和方法
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申请号： US11369391申请日： 2006-03-07
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公开(公告)号： US07488661B2公开(公告)日： 2009-02-10
- 发明人: Keith Raymond Milkove , Michael Christopher Gaidis
- 申请人： Keith Raymond Milkove , Michael Christopher Gaidis
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Keusey, Tutunjian & Bitetto, P.C.
- 代理商 Ido Tuchman
- 主分类号： H01L21/336
- IPC分类号： H01L21/336
摘要：
A device and method for improving adhesion for thin film layers includes applying a diblock copolymer on a surface where adhesion to subsequent layers is needed and curing the diblock copolymer. Pores are formed in the diblock copolymer by treating the diblock copolymer with a solvent. The surface is etched through the pores of the diblock copolymer to form adhesion promoting features. The diblock copolymer is removed, and a layer is deposited on the surface wherein the adhesion promoting features are employed to promote adhesion between the layer and the surface.
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