Invention Grant
- Patent Title: Infill for bollard footing hole
- Patent Title (中): 填充柱柱基础孔
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Application No.: US11806692Application Date: 2007-06-04
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Publication No.: US07452158B1Publication Date: 2008-11-18
- Inventor: Kin Wai Michael Siu
- Applicant: Kin Wai Michael Siu
- Applicant Address: HK Kowloon
- Assignee: Hong Kong Polytechnic University, The
- Current Assignee: Hong Kong Polytechnic University, The
- Current Assignee Address: HK Kowloon
- Agency: Sonnenschein, Nath & Rosenthal LLP
- Agent Stephen M. De Klerk
- Main IPC: E01F9/011
- IPC: E01F9/011 ; E01F9/013
Abstract:
The invention relates to an infill which can be inserted into a bollard footing hole. The infill is designed such that it allows a bollard to be fit over it, and the infill fits within a footing hole. Methods of covering a footing hole are also bought.
Public/Granted literature
- US20080295409A1 INFILL FOR BOLLARD FOOTING HOLE Public/Granted day:2008-12-04
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