Invention Grant
- Patent Title: Method of thermal processing a substrate with direct and redirected reflected radiation
- Patent Title (中): 用直接和重定向的反射辐射热处理衬底的方法
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Application No.: US11592770Application Date: 2006-11-03
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Publication No.: US07399945B2Publication Date: 2008-07-15
- Inventor: Somit Talwar , David A. Markle
- Applicant: Somit Talwar , David A. Markle
- Applicant Address: US CA San Jose
- Assignee: Ultratech, Inc.
- Current Assignee: Ultratech, Inc.
- Current Assignee Address: US CA San Jose
- Agent Allston L Jones
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/06 ; H01L21/268
Abstract:
Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.
Public/Granted literature
- US20070051708A1 Laser scanning apparatus and methods for thermal processing Public/Granted day:2007-03-08
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