Invention Grant
US07334491B2 Sensor arrangement, in particular a micro-mechanical sensor arrangement
有权
传感器布置，特别是微机械传感器装置
- Patent Title: Sensor arrangement, in particular a micro-mechanical sensor arrangement
- Patent Title (中): 传感器布置，特别是微机械传感器装置
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Application No.: US10477176Application Date: 2002-04-19
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Publication No.: US07334491B2Publication Date: 2008-02-26
- Inventor: Joachim Rudhard , Klaus Heyers
- Applicant: Joachim Rudhard , Klaus Heyers
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE10123039 20010511
- International Application: PCT/DE02/01452 WO 20020419
- International Announcement: WO02/093122 WO 20021121
- Main IPC: H01L29/82
- IPC: H01L29/82
Abstract:
A sensor array, in particular a micromechanical sensor array, and methods for manufacturing the sensor array are provided, which sensor array includes a sensor section for supplying certain sensor signals, and a cover section provided on the sensor section to form a hermetically sealed sensor interior. An electronic analyzer device is at least partially integratable into cover section for analysis of the sensor signals, and electrically connectable to a corresponding circuit device of the sensor section.
Public/Granted literature
- US20040232500A1 Sensor arrangement,in particular a micro-mechanical sensor arrangement Public/Granted day:2004-11-25
Information query
IPC分类:
