Invention Grant
- Patent Title: Low-latency equalization in multi-level, multi-line communication systems
- Patent Title (中): 多级多线通信系统中的低延迟均衡
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Application No.: US09654643Application Date: 2000-09-05
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Publication No.: US07269212B1Publication Date: 2007-09-11
- Inventor: Pak Shing Chau , Haw-Jyh Liaw , Jun Kim , Jared L. Zerbe
- Applicant: Pak Shing Chau , Haw-Jyh Liaw , Jun Kim , Jared L. Zerbe
- Applicant Address: US CA Los Altos
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Los Altos
- Agency: Silicon Edge Law Group LLP
- Agent Arthur J. Behiel
- Main IPC: H03H7/30
- IPC: H03H7/30

Abstract:
Low-latency equalization mechanisms for multi-PAM communication systems are disclosed that reduce delay and complexity in signal correction mechanisms. The equalization mechanisms tap into input signals for a multi-PAM signal driver, and compensate for attenuation along a signal transmission line, crosstalk between adjacent lines, and signal reflections due to impedance discontinuities along the line.
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