Invention Grant
- Patent Title: Methods of forming silicon quantum dots and methods of fabricating semiconductor memory devices using the same
- Patent Title (中): 形成硅量子点的方法和使用其制造半导体存储器件的方法
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Application No.: US10914994Application Date: 2004-08-10
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Publication No.: US07244679B2Publication Date: 2007-07-17
- Inventor: Kwan-Ju Koh
- Applicant: Kwan-Ju Koh
- Applicant Address: KR Seoul
- Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agent Andrew D. Fortney
- Priority: KR10-2003-0055787 20030812
- Main IPC: H01L21/311
- IPC: H01L21/311

Abstract:
Techiques for forming a silicon quantum dot, which can be applied to the formation of a semiconductor memory device, are disclosed. The techniques may include depositing a first dielectric layer on a semiconductor substrate, depositing a polysilicon layer on the first dielectric layer, forming a plurality of metal clusters on the polysilicon layer in regular distance, and etching the polysilicon layer using the plurality of metal clusters as a mask. As disclosed herein, it is possible to form the silicon quantum dots having the fineness and uniformity characteristic together with the single crystalline level characteristic.
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