Invention Grant
- Patent Title: Method of manufacturing semiconductor light emitting device
- Patent Title (中): 制造半导体发光器件的方法
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Application No.: US11326509Application Date: 2006-01-06
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Publication No.: US07172429B2Publication Date: 2007-02-06
- Inventor: Nobuyuki Tomita , Masayoshi Takemi , Akihito Ohno
- Applicant: Nobuyuki Tomita , Masayoshi Takemi , Akihito Ohno
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2005-019468 20050127
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The present invention provides a semiconductor light emitting device where a spatial change in an In composition ratio is small within a plane of an active layer and device properties such as efficiency of light emission are excellent, and a manufacturing method thereof. An active layer having an InGaN quantum well structure is formed in such a manner that a ratio of a photoluminescence light emission intensity at 300 K to a photoluminescence light emission intensity at 5 K becomes 0.1 or less. The ratio of the photoluminescence light emission intensity reflects the degree of the spatial change in an In composition ratio in a quantum confined structure. In addition, a smaller value indicates a higher spatial uniformity in the In composition ratio. Therefore, there is greater spatial uniformity in the In composition ratio in the active layer, increasing the probability of radiative recombination of carriers occurring, by making the ratio of photoluminescence light emission intensity 0.1 or less; thus, it becomes possible to obtain a semiconductor light emitting device having high efficiency in light emission.
Public/Granted literature
- US20060166392A1 Semiconductor light emitting device and manufacturing method thereof Public/Granted day:2006-07-27
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