Invention Grant
US07170070B2 Ion implanters having an arc chamber that affects ion current density
有权
离子注入机具有影响离子电流密度的电弧室
- Patent Title: Ion implanters having an arc chamber that affects ion current density
- Patent Title (中): 离子注入机具有影响离子电流密度的电弧室
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Application No.: US11227511Application Date: 2005-09-15
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Publication No.: US07170070B2Publication Date: 2007-01-30
- Inventor: Ui-hui Kwon , Gyeong-su Keum , Won-young Chung , Kwang-ho Cha , Young-tae Kim , Seung-ki Chae , Jai-hyung Won , Young-kwan Park , Tai-kyung Kim
- Applicant: Ui-hui Kwon , Gyeong-su Keum , Won-young Chung , Kwang-ho Cha , Young-tae Kim , Seung-ki Chae , Jai-hyung Won , Young-kwan Park , Tai-kyung Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2004-0075116 20040920
- Main IPC: H01J37/28
- IPC: H01J37/28

Abstract:
The present invention can provide ion implanter devices including an arc chamber including at least a first inner region and a second inner region, an electron emitting device disposed in the arc chamber adjacent the first inner region and adapted to emit electrons, an electron returning device disposed in the arc chamber adjacent the second inner region and adapted to return at least some of the electrons emitted from the electron emitting device into the second inner region; and an electric field and magnetic field generating device adapted to provide a magnetic field to the arc chamber, wherein at least one inner wall of the arc chamber has a convex surface.
Public/Granted literature
- US20060060797A1 Ion implanters having an arc chamber that affects ion current density Public/Granted day:2006-03-23
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