发明授权
- 专利标题： Semiconductor package
- 专利标题（中）： 半导体封装
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申请号： US10101108申请日： 2002-03-20
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公开(公告)号： US07148529B2公开(公告)日： 2006-12-12
- 发明人: Mitsuru Oida , Masatoshi Fukuda , Yasuhiro Koshio , Hiroshi Funakura
- 申请人： Mitsuru Oida , Masatoshi Fukuda , Yasuhiro Koshio , Hiroshi Funakura
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JPP2001-102061 20010330
- 主分类号： H01L31/72
- IPC分类号： H01L31/72 ; H01L27/15 ; H01L29/788 ; H01L31/232 ; H01L29/40
摘要：
A semiconductor package includes (a) an interposer, (b) a wiring layer containing conductors formed adjacent to each other at intervals that cause no short circuit among the conductors, the wiring layer covering a given area of the interposer, to block light from passing through the given area, (c) a light blocking layer covering a no-wiring area of the interposer not covered by the wiring layer, to block light from passing through the no-wiring area, (d) a semiconductor chip electrically connected to the wiring layer, and (e) a resin mold sealing the wiring layer, the light blocking layer, and the semiconductor chip.
公开/授权文献
- US20020140062A1 Semiconductor package 公开/授权日：2002-10-03
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