An object of the present invention is to provide a MOS transistor of a new structure and a method of manufacturing the same that is capable of easily fabricating a high integration density device by overcoming photolithography limitations. The object of the present invention is accomplished by a MOS transistor, including a semiconductor substrate having a projection in which the width of an upper portion thereof is larger than that of a lower portion thereof; an isolating layer formed in the middle of substrate of the projection; first and second drain regions formed within the surface of the substrate of the projection; first and second source regions formed within the surface of the substrate on both sides of the projection; a gate insulating layer formed on the entire surface of the substrate; and first and second gates formed on the gate insulating layer on both sides of the substrate of the projection.