Invention Grant
- Patent Title: Tailored temperature uniformity
- Patent Title (中): 定制温度均匀性
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Application No.: US10950145Application Date: 2004-09-24
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Publication No.: US07127367B2Publication Date: 2006-10-24
- Inventor: Balasubramanian Ramachandran , Joseph Michael Ranish , Ravi Jallepally , Sundar Ramamurthy , Raman Achutharaman , Brian Haas , Aaron Hunter
- Applicant: Balasubramanian Ramachandran , Joseph Michael Ranish , Ravi Jallepally , Sundar Ramamurthy , Raman Achutharaman , Brian Haas , Aaron Hunter
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LL
- Main IPC: G01K5/00
- IPC: G01K5/00 ; G01K7/00 ; G01K11/00
Abstract:
Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.
Public/Granted literature
- US20050102108A1 Tailored temperature uniformity Public/Granted day:2005-05-12
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