Invention Grant
- Patent Title: Method and apparatus for mold clamping in an injection molding machine and the like
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Application No.: US11092749Application Date: 2005-03-30
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Publication No.: US07114949B2Publication Date: 2006-10-03
- Inventor: Makoto Nishizawa , Toshihiro Kasai , Kazuhito Kobayashi , Yukio Iimura
- Applicant: Makoto Nishizawa , Toshihiro Kasai , Kazuhito Kobayashi , Yukio Iimura
- Applicant Address: JP Tokyo
- Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee: Toshiba Kikai Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: JP2002-107215 20020409
- Main IPC: B29C45/64
- IPC: B29C45/64

Abstract:
Method for mold clamping of the present invention is capable of shortening a molding cycle without any initial setting works for an engaging position of a tie bars. The method is constituted the steps of moving the tie bars in the direction of mold closing during mold close operation, judging a relative moving speed between a movable die plate and the tie bar to be within a predetermined value, engaging the tie bars with the movable die plate mechanically by operating an engaging means when the relative moving speed is judged to be within the value, then further moving the movable die plate against a fixed die plate under engagement, and after contact of a movable mold with a fixed mold driving a mold clamping cylinder, thereby executing mold clamping operation.
Public/Granted literature
- US20050170039A1 Method and apparatus for mold clamping in an injection molding machine and the like Public/Granted day:2005-08-04
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